CIOE EXPO

The 2024 18th Beijing International Semiconductor Exhibition (CIOE) is jointly sponsored by the China Equipment Management Association, China Mechanical and Electrical Products Circulation Association, and China Industrial Intelligence Technology Co., Ltd., and hosted by Jinghe Exhibition (Beijing) Co., Ltd. and Jingshang International Exhibition Co., Ltd. EXPO) will be held grandly at the China International Exhibition Center (Chaoyang Hall) in Beijing from May 30 to June 1, 2024; it will build an all-round display and communication platform for the semiconductor industry.

The Beijing International Semiconductor Exhibition (CIOE EXPO) was founded in 2005 and has been successfully held for seventeen times. It is a regular meeting of the semiconductor industry; CIOE EXPO has witnessed the improvement of the level of my country's semiconductor industry, promoted technological exchanges and integrated development of the domestic and foreign semiconductor industries, and boosted This has led to the prosperity of the domestic and foreign semiconductor technology equipment markets. It is a grand event for my country's semiconductor industry application industry. It is an important platform for the annual display of new products and new technologies and an important window for communication with the world's semiconductor technology and equipment industry. It has been regarded as an international feast by domestic and foreign semiconductor technology equipment manufacturers and related service providers. .

With the rise of China's intelligent manufacturing industry and the transformation of the global semiconductor electronics industry from a vertical structure to a horizontal structure, as well as the increasingly refined division of labor in the value chain, China is becoming one of the major production bases for global semiconductor manufacturing, and this has promoted the rapid development of China's semiconductor industry. growing up. In order to further enhance the development of the semiconductor industry, fully demonstrate the cutting-edge equipment technology of the semiconductor industry, actively promote exchanges and interactions in the semiconductor industry, strengthen the awareness of communication and cooperation in the semiconductor industry, and achieve mutual promotion and common development. ​

The 18th Beijing International Semiconductor Exhibition (CIOE EXPO) 2024 is a national, international, and professional industry event. The organizing committee strives to create all-round exhibition publicity channels and will effectively utilize traditional television media, newspapers, magazines, and the Internet. The media, WeChat, Weibo and other emerging self-media continue to ignite the enthusiasm of enterprises to participate in the exhibition. The official WeChat platform of the exhibition now has a large number of professional fans, forming interactive and timely sharing of exhibition and industry information, expanding the exhibition's publicity and influence and depth.

This exhibition will continue to increase publicity and promotion efforts, expand the scope of overseas exhibitors, and continuously improve the international level of the exhibition; the organizing committee will also focus on strengthening the organization of visitors from semiconductor equipment manufacturing companies to build a platform for Chinese semiconductor equipment companies to go abroad.

Range of exhibition

Semiconductor design, packaging and testing, manufacturing manufacturers

Raw materials: silicon wafers, silicon wafers, photoresist, photomasks, electronic gases and special chemical gases, CMP polishing materials, photoresist materials, wet electronic chemicals, sputtering targets, packaging and testing materials;

Production equipment: single crystal furnace, oxidation furnace, diffusion equipment, ion implantation equipment, PVD, CVD, photolithography machine, etching machine, polishing machine, chamfering machine, glue coating/developing machine, front-end testing equipment, wet process equipment, Thermal processing, coating equipment, single wafer deposition system, cleaning equipment;

Packaging technology and equipment: thinning machines, dicing machines, placement machines, wire bonding machines, plastic sealing machines, bending equipment, sorting machines, testing machines, robot automation, machine vision, other materials and electronic special equipment, etc.:

Testing and packaging supporting products: probe card, wire bonding, welding test, automated test, laser cutting and others, abrasive fluid, dicing fluid, sealing film (glue) high temperature tape, laminated substrate, patch adhesive, Feeding plate, welding wire, flow control, quartz graphite, silicon carbide, etc.;

Exhibition Highlights

• Focus on 5G and new infrastructure, run through the entire electronic intelligent manufacturing industry chain, and open up upstream and downstream cooperation
• A new display format with multiple scenarios and multiple production lines helps exhibitors better present all-round solutions
• New infrastructure has triggered new demands, including year-round purchase orders from industries such as consumer electronics, automotive electronics, industrial electronics, medical electronics, and wire harness processing.
• Gather heavyweight industry buyers to accurately locate core purchasing power and improve exhibitors’ return on investment
• The forum closely follows the hot topics in the industry and helps enterprises to calmly cope with new challenges.

Why exhibit?

• In exclusive meetings with top people: finding new buyers & partners
• Showcase your products and services to the world’s fastest growing market:
• Directly to thousands of high-end buyers: enhance your brand
• Through more business opportunities: Seize market opportunities to help your company gain more buyers and partners

China International Exhibition Center (Jing'an Village Pavilion)

China International Exhibition Center (Jing'an Village Pavilion) is the earliest national-level exhibition hall approved by the State Council and ranked first among the top ten buildings in Beijing in the 1980s. Since the "Asia Pacific Expo" was built and hosted in 1985, it has kicked off the vigorous development of my country's modern exhibition industry after the reform and opening up, and has effectively driven and promoted the rapid development of our country's exhibition industry, especially for my country's reform and opening up, domestic Foreign economic and technological exchanges, trade exchanges and the increasing improvement of the socialist market economic system have all played a positive and significant role in promoting.
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China International Exhibition Center Jing'anzhuang Pavilion has 8 exhibition halls, with an indoor area of more than 60,000 square meters and an outdoor area of 7,000 square meters. After more than 30 years of cultivation and development, nearly a hundred exhibitions and activities of various types are held every year, with a total exhibition area of more than 2 million square meters. It has become a professional exhibition venue that attracts attention in the industry, is widely welcomed by domestic and foreign organizers, and has the highest occupancy rate. Since the Tianzhu New Hall (Phase I) was completed and put into use in 2008, the two halls have strengthened overall coordination, professional management and integrated operation. The Jing'an Village Hall has also played an incubator role in cultivating and transporting large-scale exhibitions to the Tianzhu New Hall.
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China International Exhibition Center Jing'anzhuang Pavilion is located in the bustling commercial center of North Third Ring Road East, Chaoyang District, Beijing. It has all kinds of services, is very popular, and has obvious location advantages; it is convenient for subway, bus, and rental. In addition to serving as an important exhibition platform to promote domestic and foreign economic activities, China International Exhibition Center Jing'anzhuang Pavilion is also an ideal venue for holding annual meetings, press conferences and other company activities.